LNP™ THERMOCOMP™ AM DF004XXAR1 by SABIC is a PFAS-free, polycarbonate (PC) resin containing 20% glass fiber designed for large format additive manufacturing (LFAM) applications. It provides higher strength... view more

LNP™ THERMOCOMP™ AM EC004EXAR1 by SABIC is a polyetherimide (PEI) resin containing 20% carbon fiber. It is designed to provide a wider process window and easier flow for large format additive... view more

LNP™ THERMOCOMP™ AM EC004XXAR1 by SABIC is a flame-retardant polyetherimide (PEI) resin containing 20% carbon fiber. It is suitable for large format additive manufacturing (LFAM) applications needing higher... view more

LNP™ THERMOCOMP™ AM ZC004XXAR1 by SABIC is polyphenylene ether/polystyrene (PPE/PS) blend containing 20% carbon fiber. It is suitable for large format additive manufacturing (LFAM) applications. It offers higher... view more

LNP™ THERMOCOMP™ Compound KX97390 by SABIC is a compound based on POM (acetal) copolymer that is filled with 10% glass fiber. It offers high stiffness and strength. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound KX97390... view more

LNP™ THERMOCOMP™ Compound LC004XXP by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin filled with 20% carbon fiber. This electrically conductive grade offers high stiffness, strength and heat... view more

LNP™ THERMOCOMP™ Compound LC00AEX1 by SABIC is based on polyetheretherketone (PEEK) resin containing 50% carbon fiber. This electrically conductive grade exhibits ultra-high modulus & strength, high... view more

LNP™ THERMOCOMP™ Compound LF006EX1 by SABIC is a PFAS-free compound based on polyetheretherketone (PEEK) resin containing 30% glass fiber. It exhibits low warpage, high modulus, easy molding properties and high... view more

LNP™ THERMOCOMP™ Compound LF008EX1 by SABIC is based on polyetheretherketone (PEEK) resin containing 40% glass fiber. It exhibits high modulus, stiffness & strength and high heat resistance. This... view more

LNP™ THERMOCOMP™ Compound LX09404 by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin containing 45% carbon fiber. This electrically conductive grade displays high modulus, stiffness &... view more

LNP™ THERMOCOMP™ Compound MB006HS by SABIC is a compound based on PFAS-free, heat stabilized, low warpage, unspecified polypropylene (PP) resin that is filled with 30% glass beads. It offers high stiffness & strength... view more

LNP™ THERMOCOMP™ Compound MB006SXP by SABIC is a compound based on heat stabilized, PFAS-free, unspecified polypropylene resin that is reinforced with 30% glass beads. It exhibits high stiffness & strength and low... view more

LNP™ THERMOCOMP™ Compound MC004 by SABIC is a compound based on electrically conductive, PFAS-free, unspecified polypropylene resin that is reinforced with 20% carbon fiber. It exhibits high stiffness & strength. It... view more

LNP™ THERMOCOMP™ Compound MF004AS by SABIC is a compound based on heat stabilized, PFAS-free, unspecified polypropylene resin that is reinforced with 20% glass fiber. It exhibits high stiffness & strength. It can be... view more

LNP™ THERMOCOMP™ Compound MF006A by SABIC is a compound based on PFAS-free, unspecified polypropylene resin that is reinforced with 30% glass fiber. It exhibits high stiffness & strength. It can be processed by... view more

LNP™ THERMOCOMP™ Compound MF006AS by SABIC is a compound based on PFAS-free, unspecified polypropylene resin that is reinforced with 30% glass fiber. It exhibits high stiffness & strength. It can be processed by... view more

LNP™ THERMOCOMP™ Compound MF006SXP (Americas) by SABIC is a compound based on PFAS-free, heat stabilized, unspecified polypropylene resin that is reinforced with 30% glass fiber. It exhibits high stiffness & strength. It can be... view more

LNP™ THERMOCOMP™ Compound MF006SXP (Europe) by SABIC is a compound based on PFAS-free, heat stabilized, unspecified polypropylene resin that is reinforced with 30% glass fiber. It exhibits high stiffness & strength. It can be... view more

LNP™ THERMOCOMP™ Compound MF00AS by SABIC is a compound based on PFAS-free, heat stabilized, unspecified polypropylene resin that is reinforced with 50% glass fiber. It exhibits high stiffness & strength. It can be... view more

LNP™ THERMOCOMP™ Compound RF006SXZ by SABIC is a compound based on PFAS-free, heat stabilized, nylon 6/6 resin that is filled with 30% glass fiber. It exhibits high stiffness & strength. This grade is processed by... view more