Novamid® ID 1030-CF10 by Envalior is a polyamide 6/66 grade filled with 10% carbon-fiber. It is 3D printable at same speed as unreinforced plastics. It creates parts that are stronger, tougher and stiffer... view more

LNP™ THERMOCOMP™ AM 6C004XXAR1 by SABIC is polycarbonate/polybutylene terephthalate (PC/PBT) resin containing 20% carbon fiber suitable for large format additive manufacturing (LFAM) applications... view more

LNP™ THERMOCOMP™ AM AC004XXAR1 by SABIC is a PFAS-free, acrylonitrile butadiene styrene (ABS) resin containing 20% carbon fiber. It is suitable for large format additive manufacturing (LFAM) applications. It offers... view more

LNP™ THERMOCOMP™ AM DC004XXA11 by SABIC is a compound based on high heat PC copolymer resin containing 20% carbon fiber. It is suitable for large format additive manufacturing (LFAM) applications... view more

LNP™ THERMOCOMP™ AM EC004EXAR1 by SABIC is a polyetherimide (PEI) resin containing 20% carbon fiber. It is designed to provide a wider process window and easier flow for large format additive... view more

LNP™ THERMOCOMP™ AM JC004XXAR1 by SABIC is a PFAS-free, compound-based, polyethersulfone (PESU) resin containing 20% carbon fiber. It is designed for large format additive manufacturing (LFAM) applications needing... view more

Zytel® 3D10C20PT Pellets by Celanese is a 20% carbon fiber reinforced polyamide (PA) grade. Exhibits outstanding surface finish and excellent chemical resistance. Provides outstanding heat resistance and lower... view more

KetaSpire® PEEK AM Filament CF10 HC by Syensqo is 10% carbon fiber filled polyether ether ketone (PEEK) grade with increased strength. This filament is for premium additive manufacturing/ 3D printing applications. It... view more