EP13SPND-2 by Master Bond is a heat-curing, one-component epoxy (EP) system. Offers good electrical insulation and high adhesion. Exhibits good dimensional stability, high tensile shear, compressive... view more

EP17HTDA-2 by Master Bond is a thermally conductive, electrically insulative, one component heat cured epoxy (EP) system with high compressive strength. It is suitable for sealing and die attach... view more

EP17HTND-CCM is an electrically insulating, heat cured, one-component epoxy (EP) system by Master Bond. Resists many chemicals, such as acids, bases, fuels, salt and oils. Offers low shrinkage... view more

EP21AC by Master Bond is a halogen-free, two component epoxy (EP) system. It is durable, flame-retardant and easy-to-use grade. Offers good dimensional stability, toughness, strength and low... view more

EP21ARHT by Master Bond is a 100% reactive, two-component high performance epoxy (EP) resin system for high performance bonding, sealing, coating and encapsulating applications. It does not contain... view more

EP21FRNS-2 is a flame-retardant, halogen-free, two component epoxy (EP) system by Master Bond. Offers low smoke, good resistance to thermal cycling & shock and excellent electrical insulation... view more

EP21LVMed by Master Bond is a biocompatible, low viscosity, two component epoxy (EP) resin system for high performance bonding, sealing, coating, encapsulating and casting applications. It provides... view more

EP21TCHT-1 is a two-component epoxy (EP) system by Master Bond. Offers low coefficient of thermal expansion, good thermal conductivity and electrical insulation. Exhibits high strength and resists... view more

EP21TP-2NV by Master Bond is a versatile two component epoxy (EP) polysulfide system formulated to cure at room temperature with easy mixing forgiving 1:1 mix ratio. It is suitable for bonding... view more

EP21TPHT by Master Bond is a two component epoxy polysulfide system for bonding, sealing, coating and encapsulating applications. It offers good hardness, elongation, flexibilty, superior electrical... view more

EP29LPSP is a high performance, two-component epoxy (EP) system by Master Bond. It has low viscosity and does not contain solvent and volatiles. It bonds well with variety of substrates including... view more

EP30-2 is a two-component epoxy (EP) system by Master Bond. It has low viscosity and bonds well with variety of substrates including metals, composites, glass, ceramics and many rubbers and... view more

EP30HT-LO by Master Bond is a moderate viscosity, two component epoxy system for adhesive, sealant, coating, potting and encapsulation applications. It is highly structural, cures rigid without being... view more

EP30NS by Master Bond is a moderate viscosity, nanosilica filled two part epoxy (EP) system with good flow. It is suitable for high performance bonding, sealing, coating and encapsulation... view more

EP30QF by Master Bond is quartz filled, two component epoxy (EP) system for high performance bonding, sealing, coating, encapsulation and potting applications. It offers high dimensional... view more

EP33 is an easily machinable two-component epoxy (EP) system by Master Bond. Offers good dimensional stability and medium viscosity. Provides electrical insulation and good temperature resistance... view more

EP34LV is an easily machinable two-component epoxy (EP) system by Master Bond. Offers good dimensional stability and medium viscosity. Provides electrical insulation and good temperature resistance... view more

EP39MAOHT is a two-component epoxy (EP) system by Master Bond. It is easy to use and has low viscosity. Exhibits low shrinkage & good dimensional stability. Offers good flow, good electrical... view more

EP3HT by Master Bond is one component epoxy (EP) system for bonding, sealing, coating applications. It provides easy processing with excellent physical and bonding strength properties. It is 100%... view more

EP41S-5Med by Master Bond is a two component epoxy (EP) system for bonding, sealing and coating applications. It offers high glass transition temperature, low shrinkage upon curing and has no solvents... view more