LNP™ THERMOCOMP™ AM AC004XXAR1 by SABIC is a PFAS-free, acrylonitrile butadiene styrene (ABS) resin containing 20% carbon fiber. It is suitable for large format additive manufacturing (LFAM) applications. It offers... view more

LNP™ THERMOCOMP™ AM EC004EXAR1 by SABIC is a polyetherimide (PEI) resin containing 20% carbon fiber. It is designed to provide a wider process window and easier flow for large format additive... view more

LNP™ THERMOCOMP™ AM EC004XXAR1 by SABIC is a flame-retardant polyetherimide (PEI) resin containing 20% carbon fiber. It is suitable for large format additive manufacturing (LFAM) applications needing higher... view more

LNP™ THERMOCOMP™ AM EF004XXAR1 by SABIC is a flame-retardant polyetherimide (PEI) resin containing 20% glass fiber suitable for large format additive manufacturing (LFAM) applications. It is processed by extrusion... view more

LNP™ THERMOCOMP™ AM EZ006EXAR1 by SABIC is a flame-retardant polyetherimide (PEI) resin containing 30% milled glass fiber. It is suitable for large format additive manufacturing (LFAM) applications requiring better... view more

LNP™ THERMOCOMP™ AM ZC004XXAR1 by SABIC is polyphenylene ether/polystyrene (PPE/PS) blend containing 20% carbon fiber. It is suitable for large format additive manufacturing (LFAM) applications. It offers higher... view more

LNP™ THERMOCOMP™ Compound KFZ24XXP by SABIC is based on POM (acetal) copolymer resin containing 20% glass fiber and 10% milled glass. It offers high stiffness, good dimensional stability and low... view more

LNP™ THERMOCOMP™ Compound KX97390 by SABIC is a compound based on POM (acetal) copolymer that is filled with 10% glass fiber. It offers high stiffness and strength. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound KX97390... view more

LNP™ THERMOCOMP™ Compound LC004XXP by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin filled with 20% carbon fiber. This electrically conductive grade offers high stiffness, strength and heat... view more

LNP™ THERMOCOMP™ Compound LC006EX1 by SABIC is based on polyetheretherketone (PEEK) resin containing 30% carbon fiber. It exhibits high modulus, high impact resistance and easy molding properties... view more

LNP™ THERMOCOMP™ Compound LC006EXQ by SABIC is based on polyetheretherketone (PEEK) resin containing 30% carbon fiber. This electrically conductive grade exhibits easy molding properties, high... view more

LNP™ THERMOCOMP™ Compound LC008EXP by SABIC is based on polyetheretherketone (PEEK) resin containing 40% carbon fiber. This electrically conductive grade displays easy molding & mold release... view more

LNP™ THERMOCOMP™ Compound LC008EXQ by SABIC is based on polyetheretherketone (PEEK) resin containing 40% carbon fiber. This electrically conductive & ATEX compliant grade exhibits easy molding... view more

LNP™ THERMOCOMP™ Compound LC00AEX1 by SABIC is based on polyetheretherketone (PEEK) resin containing 50% carbon fiber. This electrically conductive grade exhibits ultra-high modulus & strength, high... view more

LNP™ THERMOCOMP™ Compound LC00APXQ by SABIC is based on polyetheretherketone (PEEK) resin containing 50% carbon fiber. It displays exceptional processing characteristics, high stiffness and... view more

LNP™ THERMOCOMP™ Compound LF002EXD-WT02005 by SABIC is based on polyetheretherketone (PEEK) resin containing 10% glass fiber. It offers custom color, high stiffness & heat resistance and easy... view more

LNP™ THERMOCOMP™ Compound LF002XXP-WT02005 by SABIC is based on polyetheretherketone (PEEK) resin containing 10% glass fiber. It offers custom color and high stiffness & high heat resistance. This... view more

LNP™ THERMOCOMP™ Compound LF003 by SABIC is based on polyetheretherketone (PEEK) resin containing 15% glass fiber. It exhibits high stiffness, modulus and heat resistance. This grade is processed by... view more

LNP™ THERMOCOMP™ Compound LF004EX1 by SABIC is based on polyetheretherketone (PEEK) resin containing 20% glass fiber. It exhibits high stiffness, easy molding properties, high heat resistance and... view more

LNP™ THERMOCOMP™ Compound LF006EX1 by SABIC is a PFAS-free compound based on polyetheretherketone (PEEK) resin containing 30% glass fiber. It exhibits low warpage, high modulus, easy molding properties and high... view more