LNP™ THERMOCOMP™ AM 6C004XXAR1 by SABIC is polycarbonate/polybutylene terephthalate (PC/PBT) resin containing 20% carbon fiber suitable for large format additive manufacturing (LFAM) applications... view more

LNP™ THERMOCOMP™ AM AC004XXAR1 by SABIC is a PFAS-free, acrylonitrile butadiene styrene (ABS) resin containing 20% carbon fiber. It is suitable for large format additive manufacturing (LFAM) applications. It offers... view more

LNP™ THERMOCOMP™ AM AF004XXAR1 by SABIC is a PFAS-free, acrylonitrile butadiene styrene (ABS) resin containing 20% glass fiber designed for large format additive manufacturing (LFAM) applications. This grade offers... view more

LNP™ THERMOCOMP™ AM DC004XXA11 by SABIC is a compound based on high heat PC copolymer resin containing 20% carbon fiber. It is suitable for large format additive manufacturing (LFAM) applications... view more

LNP™ THERMOCOMP™ AM DF004XXAR1 by SABIC is a PFAS-free, polycarbonate (PC) resin containing 20% glass fiber designed for large format additive manufacturing (LFAM) applications. It provides higher strength... view more

LNP™ THERMOCOMP™ AM EC004EXAR1 by SABIC is a polyetherimide (PEI) resin containing 20% carbon fiber. It is designed to provide a wider process window and easier flow for large format additive... view more

LNP™ THERMOCOMP™ AM EC004XXAR1 by SABIC is a flame-retardant polyetherimide (PEI) resin containing 20% carbon fiber. It is suitable for large format additive manufacturing (LFAM) applications needing higher... view more

LNP™ THERMOCOMP™ AM EF004XXAR1 by SABIC is a flame-retardant polyetherimide (PEI) resin containing 20% glass fiber suitable for large format additive manufacturing (LFAM) applications. It is processed by extrusion... view more

LNP™ THERMOCOMP™ AM EZ006EXAR1 by SABIC is a flame-retardant polyetherimide (PEI) resin containing 30% milled glass fiber. It is suitable for large format additive manufacturing (LFAM) applications requiring better... view more

LNP™ THERMOCOMP™ AM JC004XXAR1 by SABIC is a PFAS-free, compound-based, polyethersulfone (PESU) resin containing 20% carbon fiber. It is designed for large format additive manufacturing (LFAM) applications needing... view more

LNP™ THERMOCOMP™ AM ZC004XXAR1 by SABIC is polyphenylene ether/polystyrene (PPE/PS) blend containing 20% carbon fiber. It is suitable for large format additive manufacturing (LFAM) applications. It offers higher... view more

LNP™ THERMOCOMP™ AM ZF004XXAR1 by SABIC is a PFAS-free, polyphenylene ether/polystyrene (PPE/PS) blend containing 20% glass fiber. It is designed for large format additive manufacturing (LFAM) applications. It... view more

LNP™ THERMOCOMP™ Compound KFB11 by SABIC is based on POM (acetal) copolymer resin containing 5% glass fiber & glass bead. It offers low warpage, good dimensional stability and mold release... view more

LNP™ THERMOCOMP™ Compound KFZ24XXP by SABIC is based on POM (acetal) copolymer resin containing 20% glass fiber and 10% milled glass. It offers high stiffness, good dimensional stability and low... view more

LNP™ THERMOCOMP™ Compound KX97390 by SABIC is a compound based on POM (acetal) copolymer that is filled with 10% glass fiber. It offers high stiffness and strength. It can be processed by injection molding. LNP™ THERMOCOMP™ Compound KX97390... view more

LNP™ THERMOCOMP™ Compound KZ002 by SABIC is based on POM (acetal) copolymer resin containing 10% milled glass. It exhibits low warpage. This grade is processed by injection molding... view more

LNP™ THERMOCOMP™ Compound KZ006AXP by SABIC is based on POM (acetal) homopolymer resin containing 30% milled glass. It exhibits low warpage. This grade is processed by injection molding... view more

LNP™ THERMOCOMP™ Compound LC004XXP by SABIC is a compound based on PFAS-free, polyetheretherketone (PEEK) resin filled with 20% carbon fiber. This electrically conductive grade offers high stiffness, strength and heat... view more

LNP™ THERMOCOMP™ Compound LC006EX1 by SABIC is based on polyetheretherketone (PEEK) resin containing 30% carbon fiber. It exhibits high modulus, high impact resistance and easy molding properties... view more

LNP™ THERMOCOMP™ Compound LC006EXQ by SABIC is based on polyetheretherketone (PEEK) resin containing 30% carbon fiber. This electrically conductive grade exhibits easy molding properties, high... view more