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Dow Corning Unveiled Thermally Conductive Compounds for Electronics Applications at ECTC 2013

Published on 2013-06-24. Author : SpecialChem

As electronics designers and manufacturers continue to move toward smaller, faster and higher performing devices, the challenge of thermal management is steadily mounting. Less board space and increased operating frequencies are raising temperatures, and risking reduced device performance and reliability over time. To help electronics designers and manufacturers address these thermal challenges, Dow Corning introduced at ECTC 2013 two advanced new grades to its proven line of Thermal Interface Materials (TIMs).

 


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